ALD (Atomic Layer Deposition) is an advanced technology used for the deposition of thin films. It is a method of depositing materials in an atomic layer-by-layer fashion, and it has been used in many industries for a variety of applications. Research on ALD has been ongoing for many years, and it has led to the development of new materials, processes, and applications.
Recent research on ALD has focused on improving the performance of ALD-deposited materials, developing new materials for ALD applications, and exploring new applications for ALD. For example, researchers have developed new materials to increase the performance of ALD-deposited thin films, such as high-k dielectrics and metal-organic frameworks. They have also developed new processes for depositing ALD-deposited films, such as plasma-enhanced ALD and nano-imprint lithography. Additionally, researchers have explored new applications for ALD, such as catalysis and energy storage.
Overall, research on ALD is very active and ongoing. There are many areas of research that are being explored, and new developments are being made all the time. ALD is a rapidly evolving technology with many potential applications, and research on ALD will continue to be an important area of study.