PVD, or physical vapor deposition, is a process used to deposit thin layers of material onto a substrate. This process is used in a wide range of applications, from electronic components to aircraft components. PVD can be classified into four main types, based on the deposition method used.
The first type is thermal evaporation. In this method, a material is heated to a high temperature in a vacuum chamber, causing it to evaporate and deposit onto the substrate. This method is used for depositing metals, alloys, and oxides onto a substrate.
The second type is sputtering. In this method, a material target is bombarded with energetic particles, typically ions, which then dislodge atoms from the target and deposit them onto the substrate. Sputtering is used to deposit metals, alloys, and oxides, and can also be used to deposit materials that are difficult to evaporate, such as ceramics.
The third type is ion plating. In this method, a material is ionized and accelerated in an electric field towards the substrate, where it deposits onto the surface. Ion plating is used to deposit metals, alloys, and ceramics.
The fourth type is chemical vapor deposition (CVD). In this method, a material is vaporized in a chemical reaction and then deposited onto the substrate. CVD is used to deposit metals, alloys, and ceramics, as well as polymers and organic compounds.
In conclusion, PVD can be classified into four main types: thermal evaporation, sputtering, ion plating, and chemical vapor deposition. Each of these methods is used to deposit different materials onto a substrate, depending on the application.